1050 Thickness Gauge
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SPECIFICATIONS
| Description | |
|---|---|
| Application | secondary battery electrode plates,Sheet, plate extrusion | 
| Range | 0.03mm~3.6mm/0.3~30mm | 
| Width | max. 1,000mm(C-Frame), 2,000mm(O-frame) | 
| Pitch | 1mm (0.5-10mm) | 
| Spot size | 70µm/300µm | 
| Scanning Speed | 150mm/sec (50~350mm/sec) | 
| Operating temperature | Up to 45℃(60℃) | 
| Repeatability | - Reproducibility during base fabric shutdown±0.02µm(10Scan) - Reproducibility during electrode fabric movement±0.2µm (May vary depending on product quality) - Base fabric reproducibility during movement±0.1µm - Sensor resolution ±0.0025µm/0.25µm  | 
      
PROGRAM SOFTWARE
MEK程序的特点
• 用户友好型配置 - 直观界面
• 可选择语言 - 韩语,英语,中文,日语
• 用户HMI和测量数据通信(选配)
• 可根据用户要求定制 
基本界面
| Description | |
|---|---|
| Run Environment | LabVIEW-based proprietary software | 
| Data display | gsm (basis weight) / um (thickness) Spatial resolution : 1mm  | 
    
| Data compatibility | Microsoft Excel, CSV | 
| Functions | Full automatic edge detection Full mapping of entire LOT (2D & 3D reconstruction) Real-time Profile & SPC (Staitstical-Process-Control) Trend chart FFT (Fast-Fourier-Transform) Analysis of MD Profile LOT Statistics & History 4 & 20 Scan Sigma  | 
    
| Language | English, Korean, Chinese, Japanese (Hungarian translation available upon request)  | 
    
APC(Automatic Profile Control)
MEK程序的特点
- • 优化的厚度控制算法
 - • 快速厚度控制
 - • Auto Mapping: 中心螺栓标准
 - • 光滑的轧辊外观
 - • 自动调整控制增益在数微米内
 - • 模具螺栓温度反馈控制(可选)
 - • MD (Machine Direction) 控制选项(可选)
 
应用APC后的配置变化
Before
APC control begins after the target thickness is changed to 60㎛ to 30㎛
             
 
After 5min
Regulates Control Gain of auto-die, reducing variation in thickness
             
 
After 10min
Steadily analyzes and controls the thickness profiles
             
 
After 15min
Within 15min, produces the best result
            
        
 
 







