1050H Thickness Gauge
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1050H Thickness Gauge
■ One-size-fits-all Type
3-piece integrated gauge
- Thickness, Weight Measurement (Thickness, Weight, Density Simultaneous Analysis)
- + Integrate automation with contact thickness gauge
The whole process of cathode, anode, coating, and press used in the production of secondary batteries can be integrated into one measuring instrument.
3-piece integrated gauge
- Thickness, Weight Measurement (Thickness, Weight, Density Simultaneous Analysis)
- + Integrate automation with contact thickness gauge
The whole process of cathode, anode, coating, and press used in the production of secondary batteries can be integrated into one measuring instrument.
|
SPECIFICATIONS
| Description | |
|---|---|
| Application | For secondary battery electrode plate manufacturing process, coating,Roll Press |
| range | 0.03mm~3.6mm |
| width | max. 1,000mm(C-Frame), max.2,000mm(O-frame) |
| Pitch | 1mm (0.5-10mm) |
| Spot size | 70µm/300µm |
| Operating temperature | Up to 45℃(60℃) |
| Option 1 | Thickness, Weight, Integral cathode Con+β-ray anode Con+X-ray (Simultaneous analysis of thickness, weight and density) |
| Option 2 | Option 1 + Touch Type Automatic Measurement Gauge Resolution: 0.1µm |
PROGRAM SOFTWARE
Features of the MEK Program
• User-friendly Configuration - Intuitive Interface
• Language Options - English, Chinese, Japanese
• User HMI and Measurement Data Communication (Optional)
• Customization to Suit User Requirements
Default Screen
| Description | |
|---|---|
| Run Environment | LabVIEW-based proprietary software |
| Data display | gsm (basis weight) / um (thickness) Spatial resolution: 1mm |
| Data compatibility | Microsoft Excel, CSV |
| Functions | Full automatic edge detection Full mapping of entire LOT (2D & 3D reconstruction) Real-time Profile & SPC (Statistical Process Control) Trend chart FFT (Fast Fourier Transform) Analysis of MD Profile LOT Statistics & History 4 & 20 Scan Sigma |
| Language | English, Korean, Chinese, Japanese (Hungarian translation available upon request) |
APC (Automatic Profile Control)
Features of the MEK Program
- • Optimized thickness control algorithm
- • Fast thickness control
- • Auto Mapping: Center bolt reference
- • Smooth Mill Roll appearance
- • Automatic adjustment of Control Gain within a few microns
- • Die bolt temperature feedback control (optional)
- • MD (Machine Direction) control available (optional)
Profile Changes After Applying APC
Before
APC control begins after the target thickness is changed from 60㎛ to 30㎛
After 5 minutes
Regulates Control Gain of the auto-die, reducing variation in thickness
After 10 minutes
Steadily analyzes and controls the thickness profiles
After 15 minutes
Within 15 minutes, produces the best result
